New 25V rating and extended CV for 50V capacitor series (X7R) from AVX

New 25V rating AVX Capacitors Series

AVX has expanded its Mini-TurboCap and RoHS Compliant Mini-TurboCap Series with a new 25V rating and an extended capacitance range (up to 39uF) for its 50V parts.

 

Now available in 25V, 50V, and 100V, the state-of-the-art base metal electrode (BME) capacitor series exhibit high volumteric efficiency (CV) in addition to ultra low ESR and ESL in a compact footprint. Capable of conserving considerable amounts of critical board space, both Mini-TurboCap Series are ideal for I/O EMI filtering in many military and COTS+ switch mode power supply applications, industrial power converters, radar systems and aerospace power electronics, among other demanding applications.

 

"The extended voltage and capacitance ratings for our Mini-TurboCap Series BME capacitors are especially beneficial developments for design engineers working in a variety of critical markets, as there are no other capacitors on the market that can match their high CV capabilities in a similarly small footprint," said Pat Hollenbeck, applications engineer, AVX.

 

Both comprised of X7R dielectric materials, the Mini-TurboCap and RoHS Compliant Mini-TurboCap Series feature an operating temperature range of -55°C to 125°C. Capacitance values for the series' 25V parts extend to 82uF; for 50v parts, values extend to 39uF, and for 100V parts they extend to 8.2uF. The two series have been life tested to 1,000 hours at 150% of their rated voltage at +125°C.

 

Both Mini-TurboCap Series feature stress-relieving lead frames to ensure the effective mechanical decoupling of the chips from the board and mitigate the stress created by board flexing, vibration, and temperature cycling. Mini-TurboCap Series capacitors and their RoHS compliant counterparts also feature 4-pin DIP construction. Terminations for both series are available in three lead styles: straight (N), formed in (K), and formed out (M). Additionally, lead frames for both series are attached to the chips with high temperature solder, eliminating the risk of solder reflow during assembly to the board, says the company.